| 单词 | wafer |
| 释义 | wafer [英 [?we?f?(r)] 美 [?wef?] ] wafer的意思、解释 复数形式：wafers; wafer 基本解释 wafer是什么意思 名词圆片，晶片; 薄脆饼; [电]薄片; [宗]圣饼 及物动词用胶纸封 wafer 网络解释 1. 威化饼：报道指骆驼(Camel)牌香烟制造商美国雷诺(RJ Reynolds)烟草公司针对香烟销量下跌,推出不同种类的无烟烟草糖果,如润喉糖、威化饼(wafer)等. 保健促进局和卫生科学局去年提议修改抽烟(广告和销售烟草)法令,并征询公众意见. 2. 薄片：单个信号薄片(wafer)构成的1列结构上可以有6针和8针2个规格. 屏蔽接地片也集成在该薄片上,可对信号针起到严密的阻抗控制作用,不同薄片间信号针的隔离,减小串扰. 正是因为有了屏蔽接地片,使得即使在同一个薄片上的信号针都可以运行高速的差分信号. 3. 圆片：*圆片(Wafer)尺寸与衬底厚度:晶圆处理制程之主要工作为在硅晶圆上制作电路与电子元件(如电晶体管、电容器、逻辑门等),为上述各制程中所需技术最复杂且资金投入最多的过程 ,以微处理器(Microprocessor)为例,其所需处理步骤可达数百道, 4. 晶片：划片机是集成电路产业中分割IC晶片(wafer)电路单元(die)的精密切割设备;是微电子元器件生产过程中的关键工艺设备. 划片机的切割机理是强力磨削,气静压电主轴正是带动金刚石外圆刀具高速旋转(3000-6000r/min)切割(强力磨削)晶片的部件, wafer 双语例句 1. He has to add that'je ne sais quoi'that turns talent into bankable production. 他还补充说，我没法确定Wafer是否可以证明他有着成为板凳匪徒的潜质。 2. wafer 2. The basic design of 1310nm VCSELs, key technologies developed in this thesis such as material growth of tunnel junction, wafer direct-bonding and fabrication of current aperture etc are the groundworks of future VCSEL devices for performances optimizing. 本文给出的1310nm VCSEL器件设计方法、隧道结生长、晶片直接键合和电流孔径制作等关键工艺的突破为今后VCSEL器件性能优化打下了良好的基础。 3. Chemical mechanical polishing is one of core technologies in silicon substrate and IC fabrication. However, the traditional CMP technology has some disadvantages and limitations. For more better flatness and surface of silicon wafer, double side polishing was used in 300mm silicon wafer manufacture. 化学机械抛光是单晶硅衬底和集成电路制造中的关键技术之一，然而，传统的化学机械抛光技术还存在一定的缺点或局限性，为了得到更好的硅片平整度和表面洁净度，在300mm硅片的生产中采用了双面化学机械抛光技术。 4. To provide a method and apparatus for heating fluid in the proximity head of a semiconductor wafer processing system. 提供了一种用于加热接近头中的流体的设备和方法。 5. In cell, colon cancer cell line (HT29, Colo 205) and hepatoma (Hep G2, Hep 3B) which with attach character are selected, then attach on the prepared Ti disc, wafer and glass disc, by same way to get the information from the optical and IR spectra. Then the peaks were deconvoluted by the Peak Fit software. The purpose in this study is to compare the alternation of protein secondary structure between α-helix and β-type conformations in amide I region. In the tissue, the percentage of β-type conformation in tumoral tissue is higher than it''s in normal tissue, and there is a trend that the peak shift to the higher wavenumber. The result in the cell depends on the concentration of the EtOH which were treated to the cancer cell. There is a trend that peak shift to lower wavenumber in higher concentration than in the lower concentration of EtOH. 而就所得的结果而论，诊断为Carcinoma中：β—sheet由原来正常组织的24.26％变为20.05%，Random coil由25.50％变为22.71％，α—helix由29.54％变为25.01％，β—turn由20.46％变为32.08％；诊断为Adenocarcinoma中：β—sheet由原来的20.39％变为20.19％，Random coil由24.71％变为18.78％，α—helix由33.50％变为20.91％，β—turn由21.40％变为40.08％癌化组织之β结构含量较正常组织之含量为高，亦即波峰向高波数位移之倾向；细胞方面，则取决於加入酒精浓度与量的多寡，浓度高者波峰有向低波数位移之倾向并且细胞有萎缩之情形，另外在Colo 205的研究中，β—sheet，Random coil，α—helix，β—turn分别所代表在蛋白质二级结构百分比为35.42 %，28.01 %，19.77 %，16.79 %，可以得知Colo 205在Amide I中β—sheet含量最高，加上β—turn之含量，则属於β型之二级结构其含量将超过一半以上，恰可与大肠直肠癌组织之结果互为呼应。 6. It is discovered that the addition of the ingredient that can improve the absorption ability of the coating wafer will accelerate the transferring of the degradation products. 对裂解产物通过涂层的传输特性和消失模铸件渗透粘砂缺陷的形成机理进行了试验研究和理论探讨。 7. Style G wafer style body valves are designed with flangeless bodies with relatively short face-to-face dimensions. 类型G对夹式阀体阀门采用无法兰阀体结构，面对面尺寸相对较短。 8. All valves should have flanged connections. Flangeless, wafer or lugged flange style control valves shall not be used. 所有阀门宜有法兰式接口，不应使用非法兰，夹持式或耳形凸缘型调节阀。 9. wafer是什么意思 9. Temperature Motor at correct step Motor slow speed Wafer presence before oven Wafer presence after oven Output status Green lamp cycle start Blue lamp cycle reset Enable heating Enable power zone A 6-3 machine timers Camera delay time Conveyors belt running rime Enable/disable table vacuum Up/down flood squeegee delay Disable load suckers vacuum Detach magazine pieces blow air time Load suckers down delay 焦炉最高。温度汽车在正确的一步汽车速度慢晶圆存在之前，烤箱晶圆存在后，烤箱输出状态绿色灯周期的开始蓝灯周期重置使暖气使电力A区 6月3日机定时器相机延迟时间输送带带运行rime 启用/禁用表真空向上/向下防洪刮延误禁用负载吸孔真空分离杂志件，打击空中的时间负载吸孔延迟 10. Etching of graphical elements on silicon wafer has been proceeded, and the influence of experimental parameters on etching is analysed. 研究了FIB刻蚀中束斑漂移的影响和套准的作用，并在硅片上对各种图形元素的刻蚀进行了尝试，研究了刻蚀条件对结果的影响。 11. Which means Von Wafer is a gonner, it's a pity that he's been Rockets bench scoring option for the playoffs, only way Rockets can resign him is somehow get rid of Brent Barry's contract. 而如果续约了阿泰，那么韦弗就很可能要走人了。相当可惜，作为板凳上的重要重要火力，火箭要是想把他也签下的话，老巴里就合同就可能不保了。 12. Lakers waive Wafer, Pinnock Associated Press The Los Angeles Lakers requested waivers Thursday on guards Von Wafer and J. R. 洛杉矶湖人队在星期四决定裁减Von Wafer 和J.P Pinnock，剩下16名保留在球员名册。 13. API Std594 wafer type, lug type and double flange on the central check valve Std599 steel and ductile iron plug valves Std600 valve cover for the bolt connection and self-sealing of the flange, and welded connections of steel gate valve Std602 flanges, threaded and welded connections and longer connections of compact steel gate valve Std603150 pound class resistant flanged gate valve Std608 flanges, threaded and welding to connect the metal ball Std609 double flange type, wafer type and lug wafer type butterfly valve Chapter 2 inspection, testing and additional testing 2.1 to check the valve manufacturer Buyer will be in the order specified in the valve manufacturer to check the valve and the valve inspection and test witnessing. API Std594对夹式、凸耳对央式和双法兰式止回阀 Std599钢和球墨铸铁旋塞阀 Std600阀盖为螺栓连接和自压密封的法兰和对焊连接的钢闸阀 Std602法兰、螺纹和焊连接的及加长阀体连接的紧凑型钢闸阀 Std603150磅级耐腐蚀法兰连接闸阀 Std608法兰，螺纹和焊连接的金属球阀 Std609双法兰式、对夹式和凸耳对夹式蝶阀第2章检查、检验和补充检验 2.1在阀门制造厂内检查买方将在定单中规定要在阀门制造厂内检查阀门并目睹阀门的检验和试验。 14. The good luck mesteel limited company at the end of in 2006 at Ioo valley County too the xuhlghway wafer show Ihe segment invest 5, 000.000 dollars to construct modernlzsfion to cast a car twoAdd up fo 2500 square meters, can produce lO. 吉祥玛钢有限公司于2006年底在太谷县太徐公路水秀段投资500万元建造现代化铸造车间两座共计2500平方米，可生产10吨以下铸件和8000余吨玛钢件。 15. wafer是什么意思 15. In specific, the active surface of the first wafer clings down to the interval substrate, and the active surface of the second wafer clings up to the interval substrate. The first pins of the first wafer are not covered by the interval substrate, thus thickness of multi-wafer-forward stack can be reduced. 其中，第一晶片的主动面是贴附于该间隔承座的下方，第二晶片的第二背面是贴附于该间隔承座的上方，并且该间隔承座是不遮盖至该第一晶片的该些第一电极，而可达到多晶片正向堆叠的减厚功效。 16. Five novel torsion-mirror optical actuators including double-beam thickness differential structure with single torsional axis, double flexible folded-beam structure with single torsional axis, double-beam vertical torsion comb structure with single torsion axis, four-beam differential compound-micromirror structure with double torsional axis and the combined structure of the four basis forms above, are brought forward. All of these devices could be fabricated by the same silicon micromachining process we have developed. The deformation compensation design with local enhancement for the thin torsional beam which is the key structure of these devices is also put forward to improve the reliability. The three-dimension solid model and two-dimension reduced order model of the torsion-mirror optical actuator are established and then the numerical simulations for evaluating the device characteristics of the statics, dynamics, electrostatic field, mechanical and electrostatic coupling, fluid and solid coupling are carried out to optimize the structure design. Furthermore, three optical fibre clamping structures which could be integrated monolithicly are designed and analyzed to improve the optical coupling capability. 4. Three flexible process flows combined with bulk silicon micromachining and surface silicon micromachining are brought forward to fabricate these novel single-crystal silicon or polysilicon torsion-mirror optical actuators by using the same lithography masks for both SOI wafer and regular silicon wafer. A series of important process experiments are carried out to optimize the process parameters and the process flows. Some novel and typical process phenomena which occurred during the microfabrication are analyzed and then the corresponding solutions are put forward. 5. A MEMS dynamic testing system which exploit blur image synthetic technique, stroboscopic image matching technique, stroboscopic mirau microscopic interferometry technique and microscopic laser dopper vibrometer technique is set up to measure three-dimension and six-freedom micro motions of any MEMS devices with nanometer resolution. 在对硅微机械扭转镜光致动器的光机电特性系统地理论研究的基础上提出了硅微机械扭转镜光致动器的结构设计准则。3、提出了单轴双梁厚度差分结构、单轴双柔性折叠梁结构、单轴双梁垂直扭转梳齿结构、双轴四梁差动复合微镜结构以及以上四种基本结构组合后的衍生结构等五种工艺加工技术兼容的新型的硅微机械扭转镜光致动器，对器件关键结构薄厚度、高耐疲劳扭转梁进行了局部加强的变形补偿设计，建立了器件的三维实体模型以及两维降阶模型，对提出的新结构硅微机械扭转镜光致动器进行了系统的静力学、动力学、静电场、力电耦合和流体固体耦合的建模仿真与优化设计，同时设计并分析了三种可实现单芯片集成的弹性光纤定位夹紧结构。4、提出了组合体硅微加工技术与表面硅微加工技术、兼容同一套光刻版图、可分别基于SOI 晶片和普通Si 晶片、适应于制造提出的各种新结构单晶硅和多晶硅硅微机械扭转镜光致动器的三套柔性加工工艺流程，开展了一系列重要工艺步骤的单项工艺试验，对工艺流程与工艺参数进行了优化，针对加工过程中出现的具有普遍意义的典型工艺问题进行了讨论和分析，并提出了解决方法。5、创新性地将模糊图像合成技术、频闪图像匹配技术、频闪Mirau 显微干涉技术与显微激光多普勒测振技术有机结合，建立起了一套周期运动测量与瞬态运动测量相结合、单点运动测量与全视场运动测量相结合、满足不同MEMS 器件各种动态测试要求的集成的MEMS 三维六自由度微运动精密测量系统。 17. wafer 17. Omnivision and the world's largest wafer foundry have close relationship, and they own two joint ventures. Omnivision和全球第一大晶圆代工厂关系密切，两者有两个合资公司。 18. After back side grinding, the wafer thickness may be reduced, for example, to a thickness in the range of approximately 50 to approximately 100 micrometers. 在背面打磨之后，可将晶片的厚度减少到例如在大约50到大约100微米之间的厚度范围。 19. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips. 本发明的实施方案包括作为晶片级底层填料和电子芯片密封剂的用途。 20. Sea River Company, founded in 1992, specialized in the connector, switching production enterprises. 1995 Hong Kong companies into production, a joint venture with Taiwan, the introduction of Japan, Taiwan advanced production equipment and technology, the registered capital of 20 million Hong Kong dollars, the plant covers an area of 10, 000 square meters, has set the development, production, sales as one of the electronic components manufacturers, With the gradual expansion of the company, in 1997-1998, Shenzhen, Dongguan factory built and put into production, a die, metal stamping, plastic injection, product assembly, and other departments, parts production 1000000 PCS products, mainly produced DC POWER JACK, PHONE JACK, RCA JACK, MINI DIN SOCKET, FFC/FPC, CONNECTORS, TACT SWITCH, WAFER, USB, and other products. 百川河公司创建于1992年，专业从事连接器、开关生产的企业。1995年香港公司成产，与台湾合资，引进日本、台湾先进的生产设备和技术，注册资金2000万港币，厂房占地面积10000平方米，集有开发、生产、销售为一体的电子配件厂商，随着公司的逐渐扩大，在1997-1998年间，深圳、东莞工厂建成并投入生产，设有模具、五金冲压、注塑、成品组装等部门，日产量1000000PCS零件成品，主要生产DC POWER JACK，PHONE JACK，RCA JACK，MINI DIN SOCKET，FFC/FPC，CONNECTORS，TACT SWITCH，WAFER，USB等系列产品。 wafer 词典解释 1. 威化饼，薄脆饼(常与冰激凌同吃) A wafer is a thin crisp biscuit which is usually eaten with ice cream. 2. (基督教圣餐仪式上牧师发放的)圣饼 A wafer is a circular, thin piece of special bread which the priest gives people to eat in the Christian service of Holy Communion. wafer 单语例句 1. There is also my husband's favorite topping - wafer thin slices of Inner Mongolian lamb fried with caramelized onion and some really hot chili strips. 2. Wafer added five points and Chuck Hayes two as Houston led by four points late in the period. 3. Obama was the first worshipper to take communion, dipping the wafer in wine before placing it in his mouth. 4. Corneal transplants can be successfully performed in some cases using only a wafer cut from the donor cornea. 5. The company said it will also discontinue nearly 200 mW of monocrystalline wafer production to focus on multicrystalline wafers. 6. Tables are equipped with a wafer thin hot plate, the controls of which are fixed neatly to the edge of the table itself. 7. ET Solar closed its wafer plant last month, the first plant shut down in China this year. 8. Glen Davis and Von Wafer each scored 16 points to lead the Magic. 9. The new arrangement was intended to allow Suntech to save money by maximizing its internal wafer output. 10. At the Raffles Beijing, it arrives topped with a barely poached quail's egg and a rye bread wafer. wafer的翻译wafer 英英释义 noun 1. thin disk of unleavened bread used in a religious service (especially in the celebration of the Eucharist) 2. a small thin crisp cake or cookie 3. a small adhesive disk of paste used to seal letters |
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